METHODS FOR RINSING MICROELECTRONIC SUBSTRATES UTILIZING COOL RINSE FLUID WITHIN A GAS ENVIRONMENT INCLUDING A DRYING ENHANCEMENT SUBSTANCE

摘要

Rinsing and drying a surface of a microelectronic device and the enhanced removal of rinse fluid from the surface of the microelectronic device while the microelectronic device is rotated is provided as part of a spray processing operation. Rinse fluid is generally directed to the surface of the microelectronic device and drying gas is supplied after the rinsing step. During at least a portion of both rinsing and drying steps, a drying enhancement substance, such as IPA, is delivered to enhance the rinsing and drying.