发明名称 |
Ultra thin image sensor package structure and method for fabrication |
摘要 |
An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.
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申请公布号 |
US2006261428(A1) |
申请公布日期 |
2006.11.23 |
申请号 |
US20060491392 |
申请日期 |
2006.07.20 |
申请人 |
MACRONIX INTERNATIONAL CO., LTD. |
发明人 |
TSAI CHEN J.;LIN CHIH-WEN |
分类号 |
H01L31/0203;H01L21/00;H01L23/495;H01L31/0232;H01L31/024;H01L31/18 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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