THERMOPILE INFRARED SENSOR ARRAY

摘要

The invention relates to a thermopile infrared sensor array, comprising a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components, whereby the sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim of the invention is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. Said aim is achieved, whereby a thin membrane (12) made from non-conducting material is arranged on the semiconductor substrate of the sensor chip (1) on which thermopile sensor elements (13) are located in an array, whereby, under each thermopile sensor element (13), the back side of the membrane (12) is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier (VV) with a subsequent low-pass (TP) filter (6) is provided for each column and each row of sensor elements (13, 14).