| 摘要 |
The contactless circuit board comprises an isolating substrate with conductive tracks, and a mounted semiconductor chip (20). Conductive tracks (12,14) are formed by screen printing on the substrate with a conductive ink. The chip is provided with contact pads (22,24), with conductive terminals (26,28) on the contact pads. Chip insertion is timed when the ink is not dry, so the ends of the terminals penetrate into the tracks. The chip is mechanically fixed on the substrate by polymerization of an insulating adhesive resin (30). An Independent claim is also included for a card-type electronic component. |
