发明名称 |
SURFACE TREATED COPPER FOIL AND METHOD FOR PREPARING THE SAME AND COPPER-CLAD LAMINATE USING THE SAME |
摘要 |
The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatments, wherein the anti-corrosion treatment includes forming a zinc-copper-nickel ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-absorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C. |
申请公布号 |
EP1185152(A4) |
申请公布日期 |
2006.11.22 |
申请号 |
EP20010947018 |
申请日期 |
2001.01.24 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
MITSUHASHI,M.;KATAOKA,T.;TAKAHASHI,N. |
分类号 |
C25D11/38;C23C22/00;C23C22/24;C23C28/00;C23F15/00;C25D1/04;C25D3/38;C25D3/56;C25D5/10;C25D5/16;C25D5/48;C25D7/00;C25D7/06;H05K3/38;(IPC1-7):H05K3/38 |
主分类号 |
C25D11/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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