METHOD FOR MANUFACTURING A CIRCUIT BOARD BUILT-IN ELECTRONIC COMPONENTS

摘要

A fabricating method of an interconnection pattern embedded with an electronic component is provided to increase reliability of an interconnection substrate, by forming an accommodation hole on the interconnection substrate. An electronic component formed with an insulation member and a position determination unit is prepared(S110). An embodying hole corresponding to the position determination unit is formed on the insulation member(S120). The electronic component is mounted in the insulation member in order for the position determining unit to be fitted to the embodying hole(S130). A copper foil coated with an adhesive agent is installed on the insulation member to cover the electronic component(S140). The copper foil is heated and/or is pressed(S150). A via hole is formed on the copper foil to be connected to the electronic component electrically, and a circuit is formed on the aluminum foil(S160).