发明名称 |
HIGH DENSITY COMPOSITE MATERIAL |
摘要 |
The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, fiber and binder. Methods and compositions of such materials and applications thereof are disclosed herein. |
申请公布号 |
EP0907680(B1) |
申请公布日期 |
2006.11.22 |
申请号 |
EP19970936036 |
申请日期 |
1997.06.27 |
申请人 |
IDEAS TO MARKET, L.P. |
发明人 |
BRAY, ALAN, V.;MUSKOPF, BRIAN, A.;DINGUS, MICHAEL, L. |
分类号 |
C08K13/04;C08K3/08;C08K7/02;C22C32/00;C22C47/14;C22C49/00;C22C49/10;C22C49/14;F42B12/74;G21F1/10 |
主分类号 |
C08K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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