MANUFACTURING METHOD OF PCB FOR EMBEDDED CHIP

摘要

A method for fabricating a chip embedded printed circuit board is provided to prevent the damage of a chip during a fabrication process, by not using a subsidiary material like a tape to fix the chip. A laminated layer stacked with a first and a second metal layer is provided to both planes of a first insulation layer(S100). A chip mounting part is formed by removing a part of the first insulation layer and the first metal layer(S110). An adhesive material is coated in the chip mounting part, in order for a part of the chip to be mounted(S120). A second insulation layer having a window with a size corresponding to the chip and an additional laminated layer are stacked, in order to mount the remaining part of the chip(S130). A circuit pattern is formed on the second metal layer(S140).