| 摘要 |
A method for packaging flash memory cards is provided, including the steps of forming a shell base (4), placing a circuit substrate (5) inside the shell base (4) with electric contact parts (51) exposed, and using insert molding to form a monolithic shell to enclose the circuit substrate (5). The electric contacts parts (51) of the circuit substrate remain exposed. The method provides a stronger structure for memory cards, and better water-proofing against humidity leakage. |
