VIA HOLE FORMED METHOD USING LASER BEAM

摘要

A method for processing a via hole using a laser beam is provided to increase productivity by processing a number of via holes collectively. A base substrate with a revealed insulation layer corresponding to a via hole pattern part is formed(S100). A via hole is formed by scanning a laser beam with an equal width to the width of the base substrate along the length direction on the base substrate(S200). The laser beam is a multi-beam where an outer part of each single beam is overlapped, in order to obtain uniform energy density over the whole width of the laser beam.