发明名称 LIGHT EMITTING DIODE DEVICE
摘要 An LED device is provided to prevent the loss of light emitted from an LED chip by mounting horizontally the LED chip in a package using a socket type lead terminal with a predetermined groove. An LED device includes a lead frame, a package, an LED chip, a reflective member, and a molding material. The lead frame has a pair of socket type lead terminals with predetermined grooves. The package(20) is made of a synthetic resin material to hold partially the lead frame. The LED chip(60) is inserted into the predetermined groove of the lead terminal. The reflective member is formed along an inner surface of the package. The molding material(80) is filled in the package to protect the LED chip.
申请公布号 KR100650279(B1) 申请公布日期 2006.11.21
申请号 KR20050081144 申请日期 2005.09.01
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HWANG, SEOK MIN;KIM, HYUN KYUNG;LEE, DONG YUL;HONG, SANG SU;SHIN, OK HEE;HAN, JAE HO
分类号 H01L33/62;H01L33/48 主分类号 H01L33/62
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