发明名称 |
Method of constructing an integrated lead suspension |
摘要 |
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
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申请公布号 |
US7137189(B2) |
申请公布日期 |
2006.11.21 |
申请号 |
US20040964224 |
申请日期 |
2004.10.13 |
申请人 |
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V. |
发明人 |
TSUCHIYA TATSUMI;MATSUMOTO YUHSUKE;MUROKAWA TAKAAKI;FUJII NAOKI;SATOH TAKUYA;MITA YASUHIRO;TSUCHIDA HIROYASU;UEMATSU YOSHIO |
分类号 |
G11B5/127;G11B5/60;G11B5/48;G11B21/21;H04R31/00;H05K1/18;H05K3/34 |
主分类号 |
G11B5/127 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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