发明名称 Subassembly and optical module
摘要 A subassembly includes a supporting substrate having a V-shaped groove at which a member is disposed, a laser diode mounted at the supporting substrate, and a lens element, which includes a lens portion formed at a surface of an optical substrate and a projection portion having a contour which places the projection portion in contact with the V-shaped groove at the supporting substrate when the lens element is mounted, and which is positioned relative to the laser diode. An optical module includes the subassembly, a package used to package the subassembly and an interface. The interface includes an optical fiber to be optically coupled with the laser diode via the lens element and is positioned as it comes in contact with the package.
申请公布号 US7137745(B2) 申请公布日期 2006.11.21
申请号 US20040786024 申请日期 2004.02.26
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 UEKAWA MASAHIRO
分类号 G02B6/12;G02B6/26;G02B6/36;G02B6/42 主分类号 G02B6/12
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