| 摘要 |
A silicon condenser microphone having a sound hole on a substrate is provided to reduce a manufacturing cost and a processing cost by adhering a metal case to the substrate with an adhesive after laser welding. A metal case(110) has a closed bottom plane. A sound hole is formed on a substrate(120) for receiving an outer sound. A sealing terminal is formed to seal the sound hole with soldering for preventing a sound wave from being distorted between a main PCB and a microphone. A specific type semiconductor chip having a MEMS microphone chip, a voltage bumper, and a buffer IC is mounted on the substrate(120). A connection pattern is formed to be connected to the metal case(110) on the substrate(120). A fixing unit(130) fixes the metal case(110) on the substrate(120). An adhesive(140) is spread on a connection plane of the substrate(120) and the metal case(110) fixed by the fixing unit(130). The adhesive(140) connects the metal case(110) to the substrate(120). |
