发明名称 Film cooling for microcircuits
摘要 An embedded microcircuit for producing an improved cooling film over a surface of a part, comprising an inlet through which a coolant gas may enter, a circuit channel extending from the inlet through which the coolant gas may flow, and a slot film hole formed at a terminus of the circuit channel through which the coolant gas may exit a part.
申请公布号 US7137776(B2) 申请公布日期 2006.11.21
申请号 US20020176458 申请日期 2002.06.19
申请人 UNITED TECHNOLOGIES CORPORATION 发明人 DRAPER SAMUEL DAVID;BLAIR MICHAEL;ALAHYARI ABBAS
分类号 B81B1/00;F01D5/18;B81B7/04;F01D9/02;F01D25/12;F01D25/24;F02C7/18;F02C7/28;F23M5/08;F23R3/00;F23R3/06;F25D9/00;F28F13/02 主分类号 B81B1/00
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