发明名称 |
Semiconductor device and method for manufacturing the same |
摘要 |
A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.
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申请公布号 |
US7138706(B2) |
申请公布日期 |
2006.11.21 |
申请号 |
US20030608295 |
申请日期 |
2003.06.24 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ARAI YOSHIYUKI;YUI TAKASHI;TAKEOKA YOSHIAKI;ITOU FUMITO;YAMAUCHI KOUICHI;YAGUCHI YASUTAKE |
分类号 |
H01L21/44;H01L23/28;H01L21/56;H01L23/12;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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