| 摘要 |
A semiconductor package is provided to reduce the breakage due to outside pressure and the failure of products by using a molding layer made of a prepreg sheet. A semiconductor package(10) comprises a substrate(11), a chip(12) mounted on the substrate, a wire(13) for connecting the substrate to the chip, and a molding layer(14) for protecting the chip and the wire from outside. At this time, the molding layer is composed of a plurality of prepreg sheets in which a bonding agent is dipped in a reinforced fiber.
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