| 发明名称 |
Deformable semiconductor device |
| 摘要 |
A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.
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| 申请公布号 |
US7138723(B2) |
申请公布日期 |
2006.11.21 |
| 申请号 |
US20040006664 |
申请日期 |
2004.12.08 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
AIBA KAZUYUKI;TAKASHIMA AKIRA;OZAWA KANAME;HIRAOKA TETSUYA;SUZUKI TAKAAKI;MATSUZAKI YASUROU |
| 分类号 |
H01L23/31;H01L21/56;H01L21/60;H01L23/28;H01L23/433;H01L25/065;H01L27/118;H01L29/02;H01L29/06 |
主分类号 |
H01L23/31 |
| 代理机构 |
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