发明名称 |
METHOD FOR MANUFACTURING IMAGE SENSOR |
摘要 |
A method for manufacturing an image sensor is provided to prevent the damage of a substrate at a lower part of photoresist by uniformly coating the photoresist between gate electrodes. A gate conductive layer and a hard mask are sequentially deposited on a substrate(30) defined with a pixel region and a logic region. A hard mask pattern(33a) is formed at the pixel region while removing the hard mask of the logic region. A photoresist pattern(40a) is formed on the gate conductive layer. Gate electrodes(32a) are formed at the pixel and the logic regions by etching the gate conductive layer using the hard mask pattern and the photoresist pattern as a mask. A photodiode is then formed at the pixel region by implanting dopants using the hard mask pattern as an implantation barrier.
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申请公布号 |
KR100649861(B1) |
申请公布日期 |
2006.11.17 |
申请号 |
KR20050127713 |
申请日期 |
2005.12.22 |
申请人 |
MAGNACHIP SEMICONDUCTOR, LTD. |
发明人 |
BACK, WOON SUCK |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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