发明名称 DEPOSITION EQUIPMENT FOR SEMICONDUCTOR MANUFACTURING
摘要 Deposition equipment is provided to reduce remarkably a cooling time of a process tube by cooling the process tube using a cooling unit. Deposition equipment includes a process tube(110) for performing a predetermined process, a flange, a heater, and a cooling unit. The flange(130) is used for supporting the process tube. The flange is connected with a process gas supply line and a process gas exhaust line. The heater(120) is installed at an outer portion of the process tube in order to heat the inside of the process tube. The cooling unit(180) is used for cooling the process tube. The cooling unit is composed of a cooling gas supply module and a cooling gas exhaust module.
申请公布号 KR20060117581(A) 申请公布日期 2006.11.17
申请号 KR20050039518 申请日期 2005.05.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JUNG NAM
分类号 H01L21/205 主分类号 H01L21/205
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