A BONDING DEVICE AND THE BONDING METHOD FOR LIGHT EMISSION DEVICE

摘要

A bonding device and a bonding method for a light emission device are provided to arrange connecting terminals of a substrate and an interface panel by using stored images after storing and capturing the image of a pad unit. In a bonding device(100) for a light emission device, an image displaying unit(111) and a pad unit(113) are formed at an opaque substrate(110). An interface panel(170) is connected with the pad unit(113). An upper part illuminating unit(140) formed at an upper side of the substrate(110) illuminates the substrate(110). At least one upper part photographing unit(130) formed at the upper part of the substrate(110) photographs the pad unit(113) when illuminating the pad unit(113) and stores the photographed image. At least one lower part illuminating unit(150) illuminates the substrate(110) and the interface panel(170) from a bottom of the substrate(110) when arranging the interface panel(170) at an upper side of the pad unit(113).