SEMICONDUCTOR DEVICE PACKAGE

摘要

A semiconductor device package is provided to reduce thermal stress generated on an interface of a semiconductor device by forming a fiber-reinforcing polymer compound on the lateral surface of a package board so that thermal expansion of a substrate is controlled. A semiconductor device(25) functions as a heat source. The semiconductor device is mounted on the upper surface of a package board(27) having higher thermal conductivity than that of the semiconductor device. A fiber-reinforcing polymer compound(29) surrounds the lateral surface of the package board, composed of a fiber functioning as a reinforcing material and a resin part(29b) in which the fiber is included. The fiber is carbon, graphite or glass fiber.