| 摘要 |
A thin film depositing apparatus capable of preventing damage of a deposition film deposited on the substrate and preventing change in characteristics of the deposition film by properly controlling temperature of a substrate, and a thin film depositing apparatus capable of improving reliability and performance of a product using the deposition film by protecting a deposition film deposited on a substrate are provided. An apparatus for depositing a thin film comprises: a reaction chamber(16); a deposition source(D) installed within the reaction chamber; a substrate placement member(10) installed within the reaction chamber; and a temperature controller installed within the substrate placement member. The temperature controller is a cooling device and comprises: a cooling line that circulates within the substrate placement member and comprises a cooling fluid supply line(23) and a cooling fluid vent line(24); and a cooling controller(30) connected to the cooling line and installed on an outer portion of the reaction chamber. The temperature controller comprises: a drive shaft connected to the substrate placement member to rotate the substrate placement member; a housing for surrounding the drive shaft; a cooling fluid supply hole and a cooling fluid vent hole that pass through a sidewall of the housing; and a cooling controller connected to the cooling line through the cooling fluid supply hole and the cooling fluid vent hole.
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