| 摘要 |
A PCB for high frequency wavelength signals and a manufacturing method thereof are provided to safely mount electronic components on the PCB by uniformly welding hole lands on the PCB and to reduce the manufacturing cost. A PCB(Printed Circuit Board) for high frequency wavelength signals includes a lamination board(20) and an upper plate(40). Disks, on which circuits are formed, are laminated to form the lamination board. The disks are penetrated by a via hole, where a conductive material is filled. The upper plate is laminated on the lamination board and includes a second via hole, which is filled with a conductive material coupled with an upper-most circuit of the lamination board. A hole land, where a circuit element is mounted, is formed on an upper surface of the upper plate. The conductive material is copper. The via hole of the lamination board is electrically coupled with a lower-most layer pad.
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