发明名称 LIGHT EMITTING DIODE LAMP
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting diode lamp with a favorable heat dissipation property which can efficiently dissipate the heat of an LED chip. <P>SOLUTION: The light emitting diode lamp 10 comprises a substrate 14 whereon the LED chips 12 are arranged, a cover lens 16 for covering the LED chips 12 on the substrate 14, a sink 18 for supporting the substrate 14, and a base 24 which is joined to the sink 18 and formed with external terminals 22 and 22 for connection with an external power supply. At the center of the substrate 14, a heat dissipation member 26 is arranged which is made of aluminum and has a conical shape with its diameter gradually decreasing from the bottom to the top. Around the heat dissipation member 26, eight pieces of the LED chips 12 are arranged on the substrate 14 via conductor patterns 28. Moreover, the heat dissipation member 26 and each LED chip 12 are connected via the conductor pattern 28 and an insulating material 30 made of high heat dissipation resin. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006313808(A) 申请公布日期 2006.11.16
申请号 JP20050135614 申请日期 2005.05.09
申请人 OKAYA ELECTRIC IND CO LTD 发明人 MIYASAKA TOMOYUKI
分类号 H01L33/60;F21V29/00;F21Y101/02;H01L33/62;H01L33/64 主分类号 H01L33/60
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