发明名称 Leistungsmodul und Verfahren zu seiner Herstellung
摘要 A power module has a circuit carrier that, on its upper side is coated with a structured metal layer and mounted with power components. The power components are driven by flat conductors, the inner flat-conductor ends of which interact, via thermocompression heads, with contact-connection surfaces, while the outer flat-conductor ends project out of the housing of the power module. A process is described for producing the power module.
申请公布号 DE10157362(B4) 申请公布日期 2006.11.16
申请号 DE2001157362 申请日期 2001.11.23
申请人 INFINEON TECHNOLOGIES AG 发明人 HABLE, WOLFRAM
分类号 H01L23/488;H01L23/373;H01L23/495;H01L25/07 主分类号 H01L23/488
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