| 摘要 |
A substrate processing apparatus is provided to form a thick uniform insulating layer on a substrate by using an enhanced pressure control unit. A substrate processing apparatus comprises a transfer unit, a heat treatment unit, a cooling unit, and a pressure control unit. The transfer unit(22) is used for transferring a substrate to an aiming position. The heat treatment unit(53) is used for performing a heat treatment on the substrate. The cooling unit is installed adjacent to the heat treatment unit. The pressure control unit is used for adjusting properly the pressure of the heat treatment unit. The pressure control unit is capable of adjusting the pressure of the cooling unit.
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