发明名称 NITRIDE SEMICONDUCTOR ELEMENT AND ITS FABRICATION PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To provide a nitride semiconductor element having such a structure as the crystallinity of a nitride semiconductor to be grown is improved, and stripping and chipping of a substrate can be carried out very easily by employing a zinc oxide-based compound exhibiting good processability as the substrate, and to provide its fabrication process. <P>SOLUTION: When a nitride semiconductor element is formed by laying a nitride semiconductor layer on a substrate 1, the substrate 1 is composed of Mg<SB>x</SB>Zn<SB>1-x</SB>O (0<x&le;0.5), a first nitride semiconductor layer 2 composed of In<SB>y</SB>Ga<SB>1-y</SB>N (0&le;y&le;0.5) is provided in contact with that substrate 1, and nitride semiconductor layers 3-7 are laid in layers on the first nitride semiconductor layer 2 to form a semiconductor element. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006313845(A) 申请公布日期 2006.11.16
申请号 JP20050136180 申请日期 2005.05.09
申请人 ROHM CO LTD 发明人 NAKAHARA TAKESHI
分类号 H01L21/205;H01L21/338;H01L29/26;H01L29/778;H01L29/812;H01L33/06;H01L33/10;H01L33/22;H01L33/28;H01L33/32;H01S5/323 主分类号 H01L21/205
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