| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is superior in reliability and wherein there hardly occurs electrical shortcircuiting caused by migration because a surface distance can be made larger between adjoining conductors 30. <P>SOLUTION: The semiconductor device is provided with a semiconductor substrate 10, a plurality of resin parts 20 which are formed on the semiconductor substrate 10 and are arranged with an interval in distance, and a plurality of conductors 30 which are formed in a manner not to be connected to each other. The conductors 30 are formed on either of the resin parts 20, respectively. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
