| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize the size of a length and a breadth in a semiconductor-chip laminating semiconductor device. <P>SOLUTION: In a die pad 11 for loading chips for a lead frame 10; first, second, third and fourth semiconductor chips 20-1 to 20-4 at four stages are displaced and laminated while interposing an insulating spacer 30 in an intermediate section so as to be housed in the die pad 11, and the whole is sealed with a resin sealing member 40. Signals are transmitted and received with the semiconductor chips 20-2 and 20-4 on the upper side and the semiconductor chips 20-1 and 20-3 on the lower side through a plurality of electrode pads connected by wires 31. First sides 20-2a and 20-3a as the ends of the second and third semiconductor chips 20-2 and 20-3 are arranged so as to be superposed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
