发明名称 CURABLE POLYISOBUTYLENE COMPOSITION AND SEALING MEDIUM
摘要 PROBLEM TO BE SOLVED: To provide a curable polyisobutylene composition which excels in heat resistance, weatherability, quick curability, and adhesion to inorganic and organic materials and can improve low moisture permeability and resistance to staining and a sealing medium. SOLUTION: The curable polyisobutylene composition comprises (A) a reactive polyisobutylene oligomer, (B) an adhesion imparting agent, (C) a filler, and (D) a curing catalyst and is used in various adhesives, sealing media and the like. By the chemical structure containing the polyisobutylene oligomer, the heat resistance, weatherability, quick curability, and adhesion to inorganic and organic materials are excellent, and furthermore the low moisture permeability and resistance to staining can be improved. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006312666(A) 申请公布日期 2006.11.16
申请号 JP20050135235 申请日期 2005.05.06
申请人 SHIN ETSU POLYMER CO LTD 发明人 TABEI HIDEKI;FUJIKI HIRONAO;YONEYAMA MASARU
分类号 C08L23/22;C09K3/10 主分类号 C08L23/22
代理机构 代理人
主权项
地址