| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable sure temporary tacking of an electronic component, and to suppress deficiency which may occur when mounting the electronic component. <P>SOLUTION: A measurement result by a print state inspection device 21 is outputted to a component mounting device 12 through a network as shown by the arrow A. Specifically, positioning error information (information in the two-dimensional direction parallel to an inspection object surface) from a printing position of cream solder and height related information (information in the height direction vertical to the inspection object surface) of the cream solder, namely, the height, a volume value and a three-dimensional shape of the cream solder, are output. The loading position is corrected based on the information from the print state inspection device 21, and the electronic component is loaded on the printed board by a component mounting device 12. <P>COPYRIGHT: (C)2007,JPO&INPIT |
