| 摘要 |
A method for manufacturing fully silicided (FUSI) gates and devices, in particular MOSFET devices, is described. The method includes deposition a metal layer over a semiconductor layer of a gate stack, providing a first thermal budget to allow a partial silicidation of the semiconductor layer, selectively removing a remaining unreacted metal layer, and providing a second thermal budget to allow a full silicidation of the semiconductor layer. As a result, the silicide phase can be effectively controlled.
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