Electronic component-embedded printed circuit board (PCB) manufacture for e.g. mobile telephones, involves pressing metal foils against B-stage thermosetting layer to form core layer in which electronic components are embedded

摘要

The method involves mounting the electronic components (320) or active and passive components on one side of a first metal foil (310a) and disposing a B-stage thermosetting layer (330) between the first metal foil and second metal foil (310b), such that the electronic component mounted surface of the first metal foil faces the B-stage thermosetting layer. The metal foils are pressed against the B-stage thermosetting layer to form a core layer (340) in which the electronic components are embedded in the B-stage thermosetting layer. Circuit patterns are then formed on the metal foils. The electronic components are mounted on the second metal foil before the disposing step. The electronic components are mounted on the first metal foil through electrical connection using solder ball, anisotropic conductive film, conductive paste or non-conductive paste. The metal foils are made of copper.