| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board wherein a pin hole is prevented from forming in a resin layer on an electromagnetic wave shield layer. SOLUTION: A grounding wiring layer 2a and a signal wiring layer 2b are formed on a base insulating layer 1. A cover insulating layer 3 is formed on the base insulating layer 1 with an adhesive layer in between, in a manner to cover the ground wiring layer 2a and the signal wiring layer 2b excluding a partly area on the grounding wiring layer 2a. An electromagnetic wave shield layer 4 is formed on a partly area on the grounding wiring layer 2a and the cover insulating layer 3. On the other hand, a resin solution is applied onto a mold releasing sheet 6 and it is dried, thereby forming a transfer sheet formed of a resin layer 5 and the mold releasing sheet 6. Then, the surface of the resin layer 5 is laid on the upper surface of the electromagnetic wave shield layer 4, and the whole body is heated and pressed to laminate the transfer sheet on the electromagnetic wave shield layer 4. The mold releasing sheet 6 is peeled off thereafter. COPYRIGHT: (C)2007,JPO&INPIT |
