| 发明名称 |
Forming semiconductor structures |
| 摘要 |
A semiconductor structure may be covered with a thermally decomposing film. That film may then be covered by a sealing cover. Subsequently, the thermally decomposing material may be decomposed, forming a cavity.
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| 申请公布号 |
US2006255432(A1) |
申请公布日期 |
2006.11.16 |
| 申请号 |
US20060485078 |
申请日期 |
2006.07.12 |
| 申请人 |
MEAGLEY ROBERT P;O'BRIEN KEVIN P;CHEN TIAN-AN;GOODNER MICHAEL D;POWERS JAMES;LIOU HUEY-CHIANG |
发明人 |
MEAGLEY ROBERT P.;O'BRIEN KEVIN P.;CHEN TIAN-AN;GOODNER MICHAEL D.;POWERS JAMES;LIOU HUEY-CHIANG |
| 分类号 |
H01L23/58;H01L21/312;H01L21/762;H01L21/768;H01L23/522 |
主分类号 |
H01L23/58 |
| 代理机构 |
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