| 摘要 |
PROBLEM TO BE SOLVED: To improve wettability by promoting spreading of a flux using capillarity. SOLUTION: A land 4a is formed at a part of conductive pattern of a printed wiring board 1. A plurality of slits 5 for controlling spreading of a flux 8 are formed across the entire on the land 4a. The flux 8 spreads across the land 4a along the slit 5 by capillarity. COPYRIGHT: (C)2007,JPO&INPIT
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