发明名称 |
POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN |
摘要 |
Disclosed is a positive resist composition for manufacturing an MEMS by using an electron beam. This positive resist composition contains a resin component (A) whose alkali solubility is increased by the action of an acid, and an acid generator component (B) which generates an acid when irradiated with radiation. The resin component (A) is composed of a resin which is obtained by protecting a part of all the hydroxyl groups in an alkali-soluble novolac resin with an acid-cleavable dissolution inhibiting group. |
申请公布号 |
WO2006120896(A1) |
申请公布日期 |
2006.11.16 |
申请号 |
WO2006JP308692 |
申请日期 |
2006.04.26 |
申请人 |
TOKYO OHKA KOGYO CO., LTD.;SHIMBORI, HIROSHI |
发明人 |
SHIMBORI, HIROSHI |
分类号 |
G03F7/039;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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