发明名称 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
摘要 Disclosed is a positive resist composition for manufacturing an MEMS by using an electron beam. This positive resist composition contains a resin component (A) whose alkali solubility is increased by the action of an acid, and an acid generator component (B) which generates an acid when irradiated with radiation. The resin component (A) is composed of a resin which is obtained by protecting a part of all the hydroxyl groups in an alkali-soluble novolac resin with an acid-cleavable dissolution inhibiting group.
申请公布号 WO2006120896(A1) 申请公布日期 2006.11.16
申请号 WO2006JP308692 申请日期 2006.04.26
申请人 TOKYO OHKA KOGYO CO., LTD.;SHIMBORI, HIROSHI 发明人 SHIMBORI, HIROSHI
分类号 G03F7/039;H01L21/027 主分类号 G03F7/039
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