| 摘要 |
A retaining ring for CMP and its manufacturing method are provided to omit a retaining ring break-in process or to reduce remarkably the time necessary for the break-in process by treating smoothly an outer surface of the retaining ring itself. A retaining ring(400) for CMP includes a plurality of retaining parts and an annular type base ring. The plurality of retaining parts(200) are used for preventing the deviation of a wafer in the CMP by supporting fixedly sides of the wafer. The annular type base ring(300) are used for attaching the plurality of retaining parts. The roughness of an outer surface of each retaining part is in a predetermined range of 0.1 to 200 nm.
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