发明名称 |
COMPOSITE PIEZOELECTRIC SUBSTRATE |
摘要 |
<p>A composite piezoelectric substrate formed by bonding a piezoelectric substrate and a supporting substrate. A metal electrode for exciting a surface acoustic wave is formed on the surface of the piezoelectric substrate. The thickness of the metal electrode normalized by the wavelength of leakage surface acoustic wave is 0.04 or above. The supporting substrate is bonded to the piezoelectric substrate directly or through adhesive. The composite piezoelectric substrate has a large electromechanical coupling coefficient, good frequency temperature characteristics, and an especially high power resistance properties, so that the electrode does not deteriorate even high power is applied to it.</p> |
申请公布号 |
WO2006120994(A1) |
申请公布日期 |
2006.11.16 |
申请号 |
WO2006JP309232 |
申请日期 |
2006.05.08 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD.;TANNO, MASAYUKI |
发明人 |
TANNO, MASAYUKI |
分类号 |
H03H9/145;H03H3/08;H03H9/25 |
主分类号 |
H03H9/145 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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