SUBSTRATE HEAT TREATMENT APPARATUS

摘要

A substrate heat treatment apparatus is provided to perform uniformly a heat treatment on a substrate by correcting the warpage of the substrate using the suction due to a sealing unit. A substrate heat treatment apparatus includes a bake plate, a sealing unit, and a plurality of exhaust holes. The bake plate(1) has protruded portions on an upper surface. The sealing unit is installed at an upper peripheral portion of the bake plate to seal a fine space between a substrate and the bake plate. The exhaust holes(7) are used for exhausting the air from the fine space. The exhaust holes are formed on an upper surface of the bake plate.