发明名称 LIGHT EMITTING ELEMENT PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting element package having improved structure which can be manufactured by simple processes, of which the manufacturing cost can be reduced and of which the reliability and light emitting efficiency can be improved. <P>SOLUTION: The light emitting element package is provided with a package body 110 loaded with a light emitting element and capable of radiating heat generated from the light emitting element to the outside, a first electrode 112 formed integrally with the package body 110, and a second electrode 120 inserted into the package body 110 through an insulating substance. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006313896(A) 申请公布日期 2006.11.16
申请号 JP20060113735 申请日期 2006.04.17
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 KIN KYOKON;KIM YU-SIK
分类号 H01L33/44;H01L33/46;H01L33/58;H01L33/60;H01L33/62;H01L33/64;H01S5/022 主分类号 H01L33/44
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