发明名称 PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment method and a plasma treatment device wherein the base material can be treated uniformly and stably. <P>SOLUTION: This method comprises a first step of pinching the base material 18 by at least two pairs of pinch rolls 14, 16, and making the base material 18 travel at the shortest distance between two pairs of the pinch rolls 14, 16, and a second step of applying voltage to an electrode pair, generating electric discharge in a space between the electrode pair, making a treated gas 17 plasmatized after passing through its space flow out from an opening 13, and bringing the treated gas 17 into contact with the base material 18 for traveling between two pairs of the pinch rolls 14, 16 in a state that a plasma treatment head 12 having the opening 13 has been arranged so that the opening 13 is opposed to the base material 18 between two pairs of the pinch rolls 14, 16. The space is formed in order to arrange at least one of two pairs of the pinch rolls 14, 16 approaching the opening 13 while neighboring to the opening 13 of the plasma treatment head 12. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006313672(A) 申请公布日期 2006.11.16
申请号 JP20050135415 申请日期 2005.05.06
申请人 SEKISUI CHEM CO LTD 发明人 IWANE KAZUYOSHI
分类号 H05H1/24 主分类号 H05H1/24
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