| 摘要 |
<P>PROBLEM TO BE SOLVED: To effectively prevent a component damage by appropriately controlling a target load in abosorbing an electronic component or in mounting the absorbed electronic component onto a substrate with an absorption nozzle. <P>SOLUTION: A component mounting device absorbs and holds the electronic component by the absorption nozzle mounted at an absorption head moving in an XY direction and having an absorption end resiliently urged by spring and can be thrusted to mount the electronic component to the substrate fixed in the predetermined position. The load control (steps 32 to 36) of the absorption nozzle holding the correlation data previously including the relation between the thrusting amount and the thrusting load of the absorption end part and conducting so as to adjust the thrusting amount of the absorption end part to the predetermined target load on the basis of the held correlation data, and the stroke control (steps 32, 37) for controlling the thrusting amount of the absorption end part to a constant value other than the load control are selectable. <P>COPYRIGHT: (C)2007,JPO&INPIT |
