发明名称 |
Plating method for circuitized substrates |
摘要 |
A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.
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申请公布号 |
US2006255009(A1) |
申请公布日期 |
2006.11.16 |
申请号 |
US20050128272 |
申请日期 |
2005.05.13 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
CARD NORMAN A.;EDWARDS ROBERT D.;KONRAD JOHN J.;MAGNUSON ROY H.;WELLS TIMOTHY L.;WOZNIAK MICHAEL |
分类号 |
H01B13/00 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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