Method and apparatus for monitoring element alignment

摘要

The present invention relates to a method of measuring the difference in alignment between a first plan position of an element ( 1 ) and a second plan position of an element, the method comprising the use of: i) at least one rigid or taut connection ( 4 ) extending between a first point ( 2 ) at the level of the first plan position and a second point ( 3 ) at the level of the second plan position, the first and second points being at an identical displacement from the element; and ii) one or more electrolevel gauges ( 5 ) provided on the or each rigid or taut connection, so as to measure the inclination of the rigid or taut connection.