| 发明名称 |
Bildsensormodul mit einem Waferebenenpaket |
| 摘要 |
An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment. |
| 申请公布号 |
DE102004034397(B4) |
申请公布日期 |
2006.11.16 |
| 申请号 |
DE20041034397 |
申请日期 |
2004.07.16 |
| 申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. |
发明人 |
YANG, WEN KUN;YANG, WEN PIN |
| 分类号 |
H01L27/14;H01L27/144;H01L21/00;H01L21/50;H01L21/56;H01L23/12;H01L23/50;H01L27/146;H01L29/06;H01L31/00;H01L31/0203;H01L31/0232;H01L31/10;H04N5/225;H05K1/18 |
主分类号 |
H01L27/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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