| 摘要 |
PROBLEM TO BE SOLVED: To provide a ultra-thin, packaged, surface mounting type electronic component excellent in airtightness, and a circuit board to be used for this component; and to provide its manufacturing method. SOLUTION: This circuit board comprises a conductor 2 made up of a metal sheet provided in a glass sheet 7 along approximately its surface direction, and an electrode 3 and a terminal 4 formed in the conductor 2. The electrode 3 is exposed from the first principal plane 1a of the glass sheet 7, the terminal 4 is exposed from the second principal plane 1b of the glass sheet 7, and the conductor 2 is arranged at approximately the center of the first principal plane and the second principal plane of the glass sheet 7. COPYRIGHT: (C)2007,JPO&INPIT
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