发明名称 |
Memory modules including SIMM and DIMM-type connection structures and related memory systems |
摘要 |
A memory module includes a body with a plurality of memory chips mounted thereon and an elongated connector protruding from the body. The elongated connector includes a plurality of single in-line memory module (SIMM)-type contacts at first portions along an edge thereof and a plurality of dual in-line memory module (DIMM)-type contacts at second portions along the edge thereof. The plurality of SIMM-type contacts may be positioned at opposing end portions of the elongated connector, and the plurality of DIMM-type contacts may be positioned between the opposing end portions. Related memory systems including a system board having a socket therein configured to receive the memory module are also discussed.
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申请公布号 |
US2006255445(A1) |
申请公布日期 |
2006.11.16 |
申请号 |
US20060432131 |
申请日期 |
2006.05.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE KEE-HOON |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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