发明名称 Memory modules including SIMM and DIMM-type connection structures and related memory systems
摘要 A memory module includes a body with a plurality of memory chips mounted thereon and an elongated connector protruding from the body. The elongated connector includes a plurality of single in-line memory module (SIMM)-type contacts at first portions along an edge thereof and a plurality of dual in-line memory module (DIMM)-type contacts at second portions along the edge thereof. The plurality of SIMM-type contacts may be positioned at opposing end portions of the elongated connector, and the plurality of DIMM-type contacts may be positioned between the opposing end portions. Related memory systems including a system board having a socket therein configured to receive the memory module are also discussed.
申请公布号 US2006255445(A1) 申请公布日期 2006.11.16
申请号 US20060432131 申请日期 2006.05.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE KEE-HOON
分类号 H01L23/02 主分类号 H01L23/02
代理机构 代理人
主权项
地址