| 摘要 |
An integrated electronic circuit comprises active components disposed on the surface of a substrate and connected by electrical connections disposed within a metallization level. A dielectric material situated between the surface of the substrate and the metallization level, or in the metallization level, has a locally higher value of dielectric permittivity so as to selectively increase a capacitance between certain portions of the active components or of the connections. An electrical state of the circuit in operation is then stabilized, thanks to a higher electrical charge carried by the portions of the active components or of the connections whose capacitance is enhanced. The circuit can be a static random access memory cell.
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